PVD device: Coating Device high power impulse magnetron sputtering

Coating equipment High Power Impulse Magnetron Sputtering technology is a very promising promotion began to vacuum coating technology. (Began to appear in 1999) in the United States called the High Power Pulse Magnetron Sputtering (HPPMS), while in Europe called the High Power Impulse Magnetron Sputtering (HPIMS). Sounds familiar, is a magnetron sputtering, but contained very important feature: the ionization magnetron sputtering process.

Everyone knows the characteristics of ion plating, high ionization rate arcing role in the large current, thus generating a strong film bonded to the substrate. But the high temperature arc to melt locally at the target, generating small droplets, thereby generating large particles in the film, making the film surface rough. Although the filter was added to improve the film quality of the magnetic circuit, but reduces the deposition rate. Also consider droplets just out, is still in the vacuum chamber caused by pollution.

Magnetron sputtering characteristics without large particles, but mainly neutral atoms sputtered material / radical-based, kinetic mechanism of sputtering. Sputtered material is ionized magnetron sputtering main direction. The ion source was added just to improve, additional equipment and pollution elements increases. Unbalanced magnetron sputtering ionizable portions of the material, but from the rate of only 10% to 20%. Once the non-equilibrium and the magnetic circuit, which is disadvantageous diverging electron beam to burn the workpiece surface.

Vacuum coating machines, vacuum coating equipment pulse peak power pulsed magnetron sputtering power is 100 times the normal magnetron sputtering, in 1000 ~ 3000W / cm2 range. For large magnetron target, sputtering power may be generated megawatt. However, due to the time 100 to 150 microseconds, which is quite Pingjungongshuai ordinary magnetron sputtering. So as not to increase the cooling requirements. The advantage here out, at 1000 ~ 3000W / cm2 power density, a high ionization rate of the sputtered material. But this highly ionized beam free of large particles. Usually only sputtered material level 5 to 10 electron volts, while the high-power pulsed magnetron sputtering material People maximum level 100 electron volts. The biggest advantage of high-power pulsed magnetron sputtering is a high density may be plated with a film without the substrate surface temperature is significantly higher.

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