Film, introduction to thin film in vacuum coating

Film: The film can be considered a two-dimensional material. In a strict academic sense, it is believed that only materials that are thicker than a certain feature thickness are true films, otherwise they are generally thin materials. Characteristic thickness: is determined by the phenomenon that some basic properties of a substance may change abnormally when the thickness of the substance is very thin, that is, when a certain physical property or mechanical property selected as a reference begins to show a difference The thickness of the film usually has the characteristic thickness of the film.

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Film thickness: the more uniform the better, generally should be controlled within a range such as 5, which is related to the size of the plated workpiece

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Membrane surface morphology: Scanning electron microscopy (SEM) projection electron microscopy (TEM) analysis shows the state of the particles, and the density of the film surface, the defect state, and the influence of annealing treatment on the film surface can be obtained.

Membrane mechanism characteristics: The composition of the film is analyzed by X-ray diffraction to obtain information such as the purity of the film. Membrane stress: The smaller the stress inside the film, the better, and the internal pressure of the film can be released to the utmost by annealing.

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The contact characteristics of the film and the substrate mainly refer to the adhesion between the film and the substrate. Of course, the stronger the adhesion, the better the film can be avoided, and the open circuit can be avoided.

The compactness of the film: mainly refers to the hardness and abrasion resistance of the film layer, and avoids the open circuit caused by external scratches.

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Chemical and thermal stability of the film: The resistivity of the metal film layer prepared for the metal film layer is as low as possible, close to the bulk resistivity.

Scanning electron microscopy (SEM) mainly analyzes the surface information resolution by more than 10 nm, and the sample preparation is simple.

Transmission electron microscopy (TEM) mainly analyzes structural information with a resolution of less than 1 atom and is difficult to prepare.

XRD also analyzes structural information, but cannot analyze micro-domain structure information as a thin film, XRD gives direction, SEM selects a good region, and TEM deeply analyzes, which is a combination punch.

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