Sputter coating

Vacuum coating is carried out by sputtering. Due to the different coating methods, the film prepared by the same plating material will have different effects. Although it cannot be seen by the naked eye, it does have certain advantages.

The film thickness stability is good. Since the thickness of the sputter coating film layer has a great relationship with the target current and the discharge current, the higher the current, the greater the sputtering efficiency, and the thickness of the plated layer is relatively large in the same time. Because as long as the current value is controlled, it needs to be thicker, or a thin film layer. Of course, the thickness is within the allowable range, and the current is controlled. No matter how many times the plating is repeated, the film thickness is not It will change, and the stability of the film thickness can be attributed to good controllability and repeatability of the film thickness.

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The film has strong bonding force. During the sputtering process, some electrons hit the surface of the substrate, activate surface atoms, and produce a clean effect. The energy obtained by sputtering is higher than that obtained by evaporation. Up to two orders of magnitude, when such high-energy plating atoms hit the surface of the substrate, more energy can be transferred to the substrate, generating more heat, accelerating the movement of the electron-activated atoms, and parts The plating atoms are fused together earlier, and other plating atoms are deposited along with the film, which strengthens the bonding between the film and the substrate.

The plating material has a wide range. Since the sputtering coating is sputtered by high-speed bombardment of argon ions, unlike the evaporation coating, the melting point is limited to the use of a plating material having a relatively low melting point, and the sputtering coating is almost all. Solid materials can be used as plating materials.

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It can be seen from the above points that the sputtering vacuum coating is indeed better than the evaporation vacuum coating. The difference in principle determines that the thickness of the film prepared by sputtering is more stable, the bonding force is stronger, and the plating range is wider.