Multi-arc magnetron sputtering multi-function ion plating equipment LED chip manufacturing process
Multi-arc magnetron sputtering multi-function ion coating can be used to plate hard zirconium, decorative wax, alloy film or multi-layer wax on metal or non-metal surface. It can be widely used in cutting edges, molds, watches, jewelry, lamps. , construction hardware and decorative color steel plate, glasses frame, electronic products, medical equipment, instrumentation and other fields.
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Multi-arc magnetron sputtering multi-function ion coating equipment uses physical vapor deposition technology under vacuum to deposit titanium nitride and other films on the substrate. It combines multi-arc ion plating technology, cylindrical target and magnetron oil ion plating technology, and can be used alone or simultaneously to obtain various layers containing a continuous transition layer.
The multi-arc magnetron sputtering multi-function ion plating equipment is simple in manufacture, convenient to use, low in operating cost, non-polluting, and high in economic efficiency. Its double vacuum chamber can work alternately, which can double the work efficiency and save investment. The main performance indicators of the equipment are as follows: coating chamber ultimate vacuum 1.3 & times; 10 < & rsquo; -3 > Pa; vacuum time (from the atmosphere to 6.67 & times; 10 < & rsquo; -3 > Pa) & les; 20 min; The rate is 1Pa/h; the working period is 1h; the arc current is 60~90A; the arc voltage is 18~21V; the magnetron oil target power is 10~36kW. The equipment has sold dozens of sets at home and abroad and achieved good social and economic benefits.
Manufacturing process of LED chip for vacuum coating equipment
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Vacuum coating equipment LED chip manufacturing process: epitaxial wafer & rarr; cleaning & rarr; plated transparent electrode layer & rarr; transparent electrode lithography & rarr; corrosion & rarr; de-rubber & rarr; platform graphics lithography & rarr; dry etching & rarr; Glue & rarr; anneal & rarr; SiO2 deposition & rarr; window lithography & rarr; SiO2 corrosion & rarr; lacquer & rarr; N-pole lithography & rarr; pre-cleaning & rarr; coating & rarr; stripping & rarr; annealing & rarr; P-pole lithography & rarr Coating & Rarr; Stripping & Rarr; Grinding & Rarr; Cutting & Rarr; Chip & Rarr; Finished Product Testing.
The LED production process is divided into two parts. First, a gallium nitride (GaN)-based epitaxial wafer was fabricated on the liner, which was mainly performed in a metal organic chemical vapor deposition epitaxy furnace. After preparing the material source and various high-purity gases required for the GaN-based epitaxial wafer, the vacuum coating equipment can gradually complete the epitaxial wafer according to the requirements of the process. Commonly used substrates are mainly sapphire, silicon carbide and silicon substrates, as well as GaAs, AlN, ZnO and other materials. MOCVD uses a gas phase reactant (precursor) and a group III organometallic and a group V NH3 to react on the surface of the substrate to deposit the desired product on the surface of the substrate. By controlling the temperature, pressure, reactant concentration, and species ratio, the coating composition and crystal quality are controlled. MOCVD epitaxial furnace is the most commonly used equipment for making LED epitaxial wafers.
Next is the processing of the two electrodes of the LED PN junction, electrode processing is also a key process in the production of LED chips, including cleaning, evaporation, yellow light, chemical etching, fusion, grinding; then dicing, testing and substrate Sorting, you can get the LED chips you need. If the wafer cleaning is not clean enough, the vapor deposition system is not normal, which may cause the vaporized metal layer (referred to as the electrode after etching) to fall off, the appearance of the metal layer to change color, and the gold bubble and the like.
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During the evaporation process, it is sometimes necessary to fix the wafer with a spring clip, so that a pinch is generated (it must be removed in the visual inspection). Huang Guang's work includes baking, photoresist, photographic exposure, development, etc. If the development is not complete and the mask has holes, there will be more metal in the light-emitting area. In the front-end process of the wafer, various processes such as cleaning, evaporation, yellow light, chemical etching, fusion, grinding, etc. must use tweezers and flower baskets, carriers, etc., so there will be scratches in the die of the die.